The LMC is identical to the LM and LMA An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in. The LM series are general-purpose operational amplifiers which feature improved performance over LM Operational Amplifier datasheet (Rev. D) ( pdf. LM Operational Amplifier. General Description. The LM series are general purpose operational amplifi- ers which feature improved performance over.
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Description. The LM series are general purpose operational amplifi- ers. It is intended for a wide range of analog applications. The high gain and wide range. The LM series are general purpose operational amplifi- ers which feature improved performance over industry stan- dards like the LM They are direct. The LM series are general purpose operational Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Junction Temperature. Soldering Information.
LM741 Datasheet PDF
N-Package 10 seconds. J- or H-Package 10 seconds. Vapor Phase 60 seconds. Infrared 15 seconds. Effect on Product Reliability" for other methods of soldering. ESD Tolerance Note 8. Electrical Characteristics Note 5. Input Offset Voltage. Average Input Offset.
Voltage Drift. Adjustment Range.
Input Offset Current. Current Drift.
Input Bias Current. Input Resistance. Input Voltage Range. Large Signal Voltage Gain. Output Voltage Swing. Output Short Circuit. Rejection Ratio. Supply Voltage Rejection. Transient Response. C, Unity Gain. Rise Time. Bandwidth Note 6. Slew Rate. Supply Current. Power Consumption. Note 2: Operating Ratings indicate conditions for which the device is. Note 3: For operation at elevated temperatures, these devices must be derated based on thermal resistance, and T j max.
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Cerdip J. DIP N. HO8 H. SO-8 M. Note 4: For supply voltages less than? Note 5: As shown in Figure 3, the feedback resistors and the decoupling capacitors are located close to the device to ensure maximum stability and noise performance of the system. Linked contents are provided "AS IS" by the respective contributors. Created to foster collaboration among engineers. At e2e. All other trademarks are the property of their respective owners.
The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
This glossary lists and explains terms, acronyms, and definitions. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.
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downloader will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In this configuration, the output signal is in phase with the input not inverted as in the inverting amplifier configuration , the input impedance of the amplifier is high, and the output impedance is low. As shown in Figure 3, the feedback resistors and the decoupling capacitors are located close to the device to ensure maximum stability and noise performance of the system.
Differential Input Voltage. The gain of the system when measured from the mean amplitude values on the oscilloscope was 1.
Metal Can Package. Supply Voltage Rejection.
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